Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
2006
TK7870.15 .A48 2006eb
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Details
Title
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
ISBN
184663010X
Publication Details
Bradford, England : Emerald Group Publishing, c2006.
Language
English
Description
72 p.
Call Number
TK7870.15 .A48 2006eb
Access Note
Access limited to authorized users.
Added Author
Bailey, Christopher.
Liu, Johan.
Liu, Johan.
Series
Soldering & surface mount technology ; v.18, no. 2
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