Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
Liu, S. (Sheng), 1963-; Liu, Yong, 1962-
2011
TK7870.15 .L58 2011eb
Available Online

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Title Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
Author Liu, S. (Sheng), 1963-
ISBN 9780470827802 (hardback)
9780470827826 (oBook)
9780470828410 (ePub)
9781118082829 (Mobi)
9780470827819 (electronic bk.)
Publication Details Hoboken, N.J. : Wiley, 2011.
Language English
Description 1 online resource (xxii, 564 p.) : ill.
Call Number TK7870.15 .L58 2011eb
Dewey Decimal Classification 621.381/046
Summary "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.
Bibliography, etc. Note Includes bibliographical references and index.
Access Note Access limited to authorized users.
Added Author Liu, Yong, 1962-
Linked Resources Online Access
Record Appears in Online Resources > Ebooks
All Resources
pt. 1. Mechanics and modeling
pt. 2. Modeling in microelectronic packaging and assembly
pt. 3. Modeling in microelectronic package reliability and test
pt. 4. Modern modeling and simulation methodologies : application to nano packaging.

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