Fundamentals of lead-free solder interconnect technology [electronic resource] : from microstructures to reliability / Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
Lee, Tae-Kyu, author.; Bieler, Thomas R., author.; Kim, Choong-Un, author.; Ma, Hongtao, author.
2014
TK7836
Available Online

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Title
Fundamentals of lead-free solder interconnect technology [electronic resource] : from microstructures to reliability / Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
ISBN
9781461492665 electronic book
1461492661 electronic book
9781461492658
DOI
https://doi.org/10.1007/978-1-4614-9266-5
Published
New York : Springer, [2014]
Copyright
©2015
Language
English
Description
1 online resource.
Item Number
10.1007/978-1-4614-9266-5 doi
Call Number
TK7836
Dewey Decimal Classification
621.381
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed November 13, 2014).
Added Author
Lee, Tae-Kyu, author.
Bieler, Thomas R., author.
Kim, Choong-Un, author.
Ma, Hongtao, author.
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Online Access
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