3D microelectronic packaging : from fundamentals to applications / Yan Li, Deepak Goyal, editors.
Li, Yan, editor.; Goyal, Deepak, editor.
2017
TK7874
Available Online

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Title 3D microelectronic packaging : from fundamentals to applications / Yan Li, Deepak Goyal, editors.
ISBN 9783319445861 (electronic book)
3319445863 (electronic book)
9783319445847
DOI https://doi.org/10.1007/978-3-319-44586-1
Published Cham, Switzerland : Springer, 2017.
Language English
Description 1 online resource.
Item Number 10.1007/978-3-319-44586-1 doi
Call Number TK7874
Dewey Decimal Classification 621.381
Summary This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.
Bibliography, etc. Note Includes bibliographical references and index.
Access Note Access limited to authorized users.
Digital File Characteristics text file PDF
Source of Description Online resource; title from PDF title page (SpringerLink, viewed February 7, 2017).
Added Author Li, Yan, editor.
Goyal, Deepak, editor.
Series Springer series in advanced microelectronics ; 57.
Available in Other Form Print version: 9783319445847
Linked Resources Online Access
Record Appears in Online Resources > Ebooks
All Resources
Introduction to 3D Microelectronic Packaging
3D packaging architecture and assembly process design
Materials and Processing of TSV
Microstructural and Reliability Issues of TSV
Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging
Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages
Fundamentals of solder alloys in 3D packaging
Fundamentals of Electromigration in interconnects of 3D packages
Fundamentals of heat dissipation in 3D IC packaging
Fundamentals of advanced materials and processes in organic substrate technology
Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
Processing and Reliability of Solder Interconnections in Stacked Packaging
Interconnect Quality and Reliability of 3D Packaging
Fault isolation and failure analysis of 3D packaging.

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