RF and microwave microelectronics packaging II / Ken Kuang, Rick Sturdivant, editors.
2017
TK7870.15
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Details
Title
RF and microwave microelectronics packaging II / Ken Kuang, Rick Sturdivant, editors.
ISBN
9783319516974 (electronic book)
3319516973 (electronic book)
9783319516967
3319516965
3319516973 (electronic book)
9783319516967
3319516965
Published
Cham, Switzerland : Springer, 2017.
Language
English
Description
1 online resource (xii, 172 pages) : illustrations.
Item Number
10.1007/978-3-319-51697-4 doi
Call Number
TK7870.15
Dewey Decimal Classification
621.381/046
Summary
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Note
Includes index.
Access Note
Access limited to authorized users.
Digital File Characteristics
text file PDF
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed March 22, 2017).
Description based on print version record.
Description based on print version record.
Added Author
Kuang, Ken, editor.
Sturdivant, Rick, editor.
Sturdivant, Rick, editor.
Available in Other Form
Print version: 9783319516967
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Online Access
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