Machine generated contents note: References
pt. 1 Introduction to Hermetic Packages and Leak Types
1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication
1.1.Introduction
1.2.The Evolution of Microelectronics and MEMS Packages
1.3.MEMS Sealing Techniques and Mode Package Fabrication
1.3.1.Materials
1.3.2.Sealing Techniques
1.4.Summary of MEMS Packaging Materials and Techniques
References
2.Assembly, Packaging, and Environmentally Induced Failures in MEMS
2.1.Introduction
2.2.Particle Contamination
2.3.Thermomechanical Constraints
2.3.1.Thermomechanical Constraints in Die Attach
2.3.2.Thermomechanical Constraints in Package-Level Encapsulation
2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation
2.3.4.Thermomechanical Constraints in Flip-Chip Bonding
2.4.Moisture and Gas Absorption
2.4.1.Moisture Absorption
2.4.2.Barrier Coatings: A Protection Against Moisture Absorption
2.4.3.Outgassing
2.5.Conclusions: Reliability Demonstration and Accelerated Testing
References
3.Packaging Requirements for Hermeticity
3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging
3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package
References
4.The Different Types of Leaks in MEMS and Microelectronics Packaging
4.1.Introduction
4.2.Leak Channels or Capillary Leaks
4.3.Permeation
4.4.Outgassing
4.5.Conclusion
References
pt. 2 Traditional Hermeticity Test Techniques and Standards
5.Ex Situ Hermeticity Test Methods
5.1.Introduction
5.2.Fine Leak Tests
5.2.1.Helium Fine Leak Test
5.2.2.Radioisotope Leak Detection Method
5.3.Gross Leak Tests
5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection
5.3.2.Gross Bubble Test
5.3.3.Weight Gain
5.3.4.Dye Penetrant Gross Leak Test
5.4.Combinational Tests
5.4.1.Optical Fine/Gross Leak Detection Method
5.4.2.Cumulative Helium Leak Detection (CHLD) Method
References
6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071
6.1.Introduction: The First Hermeticity Tests
6.2.The Introduction of the Military Standards
6.3.The First Problems with Traditional Hermeticity Tests and Standards
6.4.Military Standard Revisions
6.5.Summary
References
pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages
7.Permeation
7.1.Introduction
7.2.Mathematics of Permeation
7.3.Limitations of the Packaging Material
7.4.Conclusions
References
8.Outgassing and Residual Gas Analysis (RGA)
8.1.Outgassing
8.2.Residual Gas Analysis
References
9.Low-Cavity Volume Capillary Leak Limitations
9.1.Limitations of the Helium Fine Leak Test Method
9.1.1.Volume Limitations
9.1.2.Minimum Detectable Leak Rate
References
pt. 4 Novel Methods of Leak Detection
10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method
10.1.Introduction
10.2.Lumped Element Modeling of a Microresonator
10.3.Definitions and Measurement Methods of the Quality Factor Q
10.3.1.Definition in Terms of Stored Energy
10.3.2.Definition in Terms of Bandwidth
10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement
10.3.4.Determination of the Q-Factor by Phase Measurement
10.4.Relation Between Pressure and Q-Factor
References
11.In Situ Test Methods in Development
11.1.Introduction
11.2.Copper Test Structures
11.3.Micro-Pirani Gauge
References
12.Ex Situ Hermeticity Test Methods in Development
12.1.Introduction
12.2.FTIR Spectroscopy
12.2.1.Application to Hermeticity
12.2.2.Theoretical Limitations
12.2.3.Practical Considerations
12.2.4.Summary
12.3.Raman Spectroscopy
12.3.1.Application to the Hermeticity Test
12.3.2.Theoretical Limitations
12.3.3.Practical Considerations
12.3.4.Summary
References
pt. 5 Conclusions and Vision
13.Summary of Hermeticity Test Methods
14.The Way Forward
14.1.Introduction
14.2.Improvement on Existing Techniques
14.3.New Hermetic Materials and Hermeticity Test Methods
14.4.Conclusions
References.