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Intro; Foreword to the First Edition; Foreword to the Second Edition; Preface; Contents; Contributors; Chapter 1: Nanopackaging: Nanotechnologies and Electronics Packaging; 1.1 Introduction; 1.2 Computer Modeling; 1.3 Nanoparticles; 1.3.1 Nanoparticles: Introduction; 1.3.2 Nanoparticles: Fabrication; 1.3.3 Nanoparticles: Embedded Capacitors; 1.3.4 Nanoparticles: Embedded Resistors; 1.3.5 Electrically Conductive Adhesives; 1.3.6 Nanoparticles: Sintered Interconnect; 1.3.7 Nanosolder; 1.3.8 Nanoparticles in Solder; 1.3.9 Nanoparticles: Nanocomposites; 1.4 Carbon Nanotubes (CNTs).
1.4.1 CNTs: Fabrication1.4.2 CNTs: Composites; 1.4.3 CNTs: Thermal; 1.4.4 Carbon Nanotubes: Electrical; 1.4.5 Nanowires; 1.5 Graphene; 1.5.1 Graphene: Introduction; 1.5.2 Graphene: Nanocomposites; 1.5.3 Graphene: Thermal; 1.5.4 Graphene: Electrical; 1.6 Nanoscale Structures; 1.7 Nano-interconnects; 1.8 Plasmonic Interconnects; 1.9 Miscellaneous; 1.10 EHS: Environment, Health, and Safety; 1.11 Conclusion; References; Chapter 2: Modelling Technologies and Applications; 2.1 Introduction; 2.2 Modelling Technologies; 2.2.1 Continuum Modelling; 2.2.2 Atomistic and Multi-scale Modelling.
2.2.3 Optimisation and Uncertainty2.2.4 Future Challenges for Modelling Tools; 2.3 Modelling Applied to Fabrication Processes; 2.3.1 Modelling of Focussed Ion Beam Milling Process; 2.3.2 Modelling of Nanoimprint Lithography (NIL) Process; 2.3.3 Modelling of Electroforming Processes; 2.3.4 Modelling of Additive Manufacturing Processes; 2.4 Modelling Applied to Assembly Processes; 2.4.1 Solder Paste Printing; 2.4.2 Molecular Dynamics Calculation of Solder Reflow Process; 2.4.3 Microwave Heating in Microelectronics and Nano-packaging Applications; 2.5 Modelling Applied to Reliability Predictions.
2.5.1 The Effects of Underfills on Solder Joint Reliability2.5.2 Modelling of Anisotropic Conductive Films (ACFs); 2.5.3 Metal Migration-Related Damages in Nano-packaging; 2.5.4 Thermal Interface Materials; 2.6 Conclusions; References; Chapter 3: Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects; 3.1 Introduction; 3.1.1 Delamination-Related Failures in Micro- and Nano-electronics; 3.1.2 Metal-Polymer Adhesion: A Multi-scale Phenomenon; 3.1.3 On the Meaning of the Experimentally Measured Interface Fracture Toughness; 3.1.4 Scope of the Chapter.
3.2 Interface Fracture Mechanics3.3 Buckling-Driven Delamination in Flexible Displays; 3.3.1 Experiments; 3.3.2 Numerical Analysis; 3.4 Multi-scale Mechanics of High Toughness Fibrillating Interfaces in Stretchable Electronics; 3.4.1 Experimental Analysis; 3.4.2 Numerical Analysis; 3.5 Competition Between Adhesive and Cohesive Failure at Patterned Surfaces; 3.5.1 Experimental Results; 3.5.2 Numerical Results; 3.6 Integrated Digital Image Correlation (IDIC) for Small-Scale Characterization of Adhesion Properties; 3.6.1 The Integrated Digital Image Correlation Technique.
1.4.1 CNTs: Fabrication1.4.2 CNTs: Composites; 1.4.3 CNTs: Thermal; 1.4.4 Carbon Nanotubes: Electrical; 1.4.5 Nanowires; 1.5 Graphene; 1.5.1 Graphene: Introduction; 1.5.2 Graphene: Nanocomposites; 1.5.3 Graphene: Thermal; 1.5.4 Graphene: Electrical; 1.6 Nanoscale Structures; 1.7 Nano-interconnects; 1.8 Plasmonic Interconnects; 1.9 Miscellaneous; 1.10 EHS: Environment, Health, and Safety; 1.11 Conclusion; References; Chapter 2: Modelling Technologies and Applications; 2.1 Introduction; 2.2 Modelling Technologies; 2.2.1 Continuum Modelling; 2.2.2 Atomistic and Multi-scale Modelling.
2.2.3 Optimisation and Uncertainty2.2.4 Future Challenges for Modelling Tools; 2.3 Modelling Applied to Fabrication Processes; 2.3.1 Modelling of Focussed Ion Beam Milling Process; 2.3.2 Modelling of Nanoimprint Lithography (NIL) Process; 2.3.3 Modelling of Electroforming Processes; 2.3.4 Modelling of Additive Manufacturing Processes; 2.4 Modelling Applied to Assembly Processes; 2.4.1 Solder Paste Printing; 2.4.2 Molecular Dynamics Calculation of Solder Reflow Process; 2.4.3 Microwave Heating in Microelectronics and Nano-packaging Applications; 2.5 Modelling Applied to Reliability Predictions.
2.5.1 The Effects of Underfills on Solder Joint Reliability2.5.2 Modelling of Anisotropic Conductive Films (ACFs); 2.5.3 Metal Migration-Related Damages in Nano-packaging; 2.5.4 Thermal Interface Materials; 2.6 Conclusions; References; Chapter 3: Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects; 3.1 Introduction; 3.1.1 Delamination-Related Failures in Micro- and Nano-electronics; 3.1.2 Metal-Polymer Adhesion: A Multi-scale Phenomenon; 3.1.3 On the Meaning of the Experimentally Measured Interface Fracture Toughness; 3.1.4 Scope of the Chapter.
3.2 Interface Fracture Mechanics3.3 Buckling-Driven Delamination in Flexible Displays; 3.3.1 Experiments; 3.3.2 Numerical Analysis; 3.4 Multi-scale Mechanics of High Toughness Fibrillating Interfaces in Stretchable Electronics; 3.4.1 Experimental Analysis; 3.4.2 Numerical Analysis; 3.5 Competition Between Adhesive and Cohesive Failure at Patterned Surfaces; 3.5.1 Experimental Results; 3.5.2 Numerical Results; 3.6 Integrated Digital Image Correlation (IDIC) for Small-Scale Characterization of Adhesion Properties; 3.6.1 The Integrated Digital Image Correlation Technique.