Introduction to Electrical 3D Integration
Copper-based TSV
Interposer
Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization
Energy Efficient Electrical Intra-Chip Stack Communication
Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks
Energy Efficient Communications Employing 1-Bit Quantization at the Receiver
2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications
Accurate Temperature Measurement for 3D Thermal Management
EDA Environments for 3D Chip Stacks
Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias
Introduction to Optical Inter- and Intraconnects
Optical Through-Silicon Vias
Integrated Optical Devices for 3D Photonic Transceivers
Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators
Athermal photonic circuits for optical on-chip interconnects
Integrated Circuits for 3D Photonic Transceivers
Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.